Skip to main content

Thin-film deposition

The David Bullett Nanofabrication Facility houses various systems for the deposition of thin layers of metal and non-metal materials.


Person using the sputter coater
Our sputter coater allows deposition of metallic and non-metallic thin films

A variety of thin film deposition systems are available. These include thermal or electron-beam evaporators, a magnetron sputter coater and plasma-enhanced chemical vapour deposition (PECVD).

Our Moorfield Minilab E080A electron beam evaporator can accommodate eight evaporation sources and has a load-lock system for rapid throughput of samples. It can deposit a range of metals including; Al, Cu, Ni, Ti, Pt, PD Cr, Mo, W and dielectrics including SiO2 and ITO.
Also available is the Edwards FL-400 electron beam evaporator.

Our Moorfield Minilab T060M thermal evaporator has four evaporation sources and can deposit thin metal films including: Au, Ag, Al Ge, Ni, Cr.
Also available is the Edwards Auto 306 thermal evaporator.

Our Plasma Therm 790 series plasma-enhanced chemical vapour deposition (PECVD) system allows the deposition of thin films of SiO2 and SiNx.

Our HHV sputter coater allows DC and RF sputtering from 3 sputtering heads of various thin films. Our current targets include Al, Au, AZO, Co, Cr, FeO2, ITO, Nb, Pt, Py (Ni-Fe), Si3N4, SiO2, Ta, Ti, TiO2, WO3, Zn, ZnO. The system also allows for substrate heating, reactive sputtering with O2 and co-sputtering with simultaneous DC and RF sputtering.

Contact us to use this equipment

Send an email to


If you have any questions, please contact us.

On this page