A variety of thin film deposition systems are available. These include thermal or electron-beam evaporators, a magnetron sputter coater and plasma-enhanced chemical vapour deposition (PECVD).
Our Edwards FL-400 electron beam evaporator can evaporate thin metal films, e.g. Al, Ni, Ti, Au, Pt, Pd, Cr, Mo, W, dielectrics, e.g. SiO_2, and other materials, e.g. ITO.
Our Edwards AUTO 306 thermal evaporator can evaporate thin metal films, e.g. Au, Ge, Ni, Ti, Cr, Cu, Al, Ag.
Our Plasma Therm 790 series plasma-enhanced chemical vapour deposition (PECVD) system allows the deposition of thin films of SiO2 and SiNx.
Our HHV sputter coater allows DC and RF sputtering from 3 sputtering heads of various thin films. Our current targets include Al, Au, AZO, Co, Cr, FeO2, ITO, Nb, Pt, Py (Ni-Fe), Si3N4, SiO2, Ta, Ti, TiO2, WO3, Zn, ZnO. The system also allows for substrate heating, reactive sputtering with O2 and co-sputtering with simultaneous DC and RF sputtering.