The University of Bath has a facility for the production and characterisation of nano and micro-scale devices that is available to all researchers at the University, the David Bullett Nanofabrication Facility (Nanofab).
If you would like to see what equipment and services are on offer, please contact Dr Stephen Wedge to arrange a tour of the facility.
The Nanofab is a ‘user’ facility where researchers are given full training and support in the operation of equipment, thus allowing them to fabricate their own devices. This gives researchers freedom to work to their own schedules rather than waiting on the availability of support staff. It also provides researchers with skills and knowledge which can be invaluable in the progression of their careers.
Equipment overview
Thin film deposition
- Sputter coating for both metal and dielectric materials.
- Electron-beam evaporation for the deposition of high purity metals and SiO2. Includes load-lock facility for rapid throughput.
- Plasma Enhanced Chemical Vapour Deposition (PECVD) of SiO2 and SiNx films.
- Thermal Evaporation.
Etching
- Reactive Ion Etching (RIE)/ Inductively Coupled Plasma (ICP) dry etching of semiconductor, oxide, nitride and metal surfaces.
- Wet etching facilities, including dedicated Hydrofluoric Acid workstation.
Lithography
- Electron Beam Lithography for nanoscale (≥50nm) patterning.
- Direct Laser Writer for the creation of bespoke designed photoresist patterns with features down to 1 µm over an area of 4” wafer/mask plate.
- Displacement Talbot Lithography for the creation of sub-micron, large area periodic structures.
- MJB3 Optical Mask Aligner
Characterisation
- Hitachi Field Emission Scanning Electron Microscope (SEM)
- Dektak Surface Profiler
- Filmetrics Reflectometry system